Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Qingke Zhang
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces - Springer 2016
978-3-662-48823-2
"Engineering; Surfaces and Interfaces, Thin Films; Classical Mechanics; Characterization and Evaluation of Materials"
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces - Springer 2016
978-3-662-48823-2
"Engineering; Surfaces and Interfaces, Thin Films; Classical Mechanics; Characterization and Evaluation of Materials"