RF and Microwave Microelectronics Packaging II
"Ken Kuang, Rick Sturdivant"
RF and Microwave Microelectronics Packaging II - Springer 2017
978-3-319-51697-4
"Engineering; Electronics and Microelectronics, Instrumentation; Microwaves, RF and Optical Engineering; Circuits and Systems"
RF and Microwave Microelectronics Packaging II - Springer 2017
978-3-319-51697-4
"Engineering; Electronics and Microelectronics, Instrumentation; Microwaves, RF and Optical Engineering; Circuits and Systems"