3D Microelectronic Packaging
"Yan Li, Deepak Goyal"
3D Microelectronic Packaging - Springer 2017
978-3-319-44586-1
"Engineering; Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Electronic Circuits and Devices; Microengineering; Nanotechnology and Microengineering; Metallic Materials"
3D Microelectronic Packaging - Springer 2017
978-3-319-44586-1
"Engineering; Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Electronic Circuits and Devices; Microengineering; Nanotechnology and Microengineering; Metallic Materials"