TY  - BOOK
AU  - "Ken Kuang, Rick Sturdivant"
TI  - RF and Microwave Microelectronics Packaging II
SN  - 978-3-319-51697-4
PB  - Springer
KW  - "Engineering; Electronics and Microelectronics, Instrumentation; Microwaves, RF and Optical Engineering; Circuits and Systems"
UR  - http://link.springer.com/openurl?genre=book&isbn=978-3-319-51697-4
ER  -