"Yan Li, Deepak Goyal" <br/><br/>
3D Microelectronic Packaging 

 -  Springer  2017 
<br/><br/><label>ISBN: </label>978-3-319-44586-1 
<br/><br/><label>Subjects--Topical Terms: </label><br/>"Engineering; Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Electronic Circuits and Devices; Microengineering; Nanotechnology and Microengineering; Metallic Materials"