TY  - BOOK
AU  - "Yan Li, Deepak Goyal"
TI  - 3D Microelectronic Packaging
SN  - 978-3-319-44586-1
PB  - Springer
KW  - "Engineering; Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Electronic Circuits and Devices; Microengineering; Nanotechnology and Microengineering; Metallic Materials"
UR  - http://link.springer.com/openurl?genre=book&isbn=978-3-319-44586-1
ER  -