Jie Cheng <br/><br/>
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect  

 -  Springer  2018 
<br/><br/><label>ISBN: </label>978-981-10-6165-3 
<br/><br/><label>Subjects--Topical Terms: </label><br/>"Engineering; Tribology, Corrosion and Coatings; Electronics and Microelectronics, Instrumentation"