TY  - BOOK
AU  - Jie Cheng
TI  - Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect 
SN  - 978-981-10-6165-3
PB  - Springer
KW  - "Engineering; Tribology, Corrosion and Coatings; Electronics and Microelectronics, Instrumentation"
UR  - http://link.springer.com/openurl?genre=book&isbn=978-981-10-6165-3
ER  -