John H. Lau <br/><br/>
Fan-Out Wafer-Level Packaging 

 -  Springer  2018 
<br/><br/><label>ISBN: </label>978-981-10-8884-1 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Engineering; Circuits and Systems; Nanotechnology and Microengineering; Optical and Electronic Materials