Seonho Seok <br/><br/>
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering 

 -  Springer  2018 
<br/><br/><label>ISBN: </label>978-3-319-77872-3 
<br/><br/><label>Subjects--Topical Terms: </label><br/>"Engineering; Nanotechnology; Nanotechnology and Microengineering; Characterization and Evaluation of Materials; Tribology, Corrosion and Coatings"