TY  - BOOK
AU  - Keser
TI  - Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
SN  - 9781119313991
PB  - IEEE
KW  - "Components, Circuits, Devices and Systems; Computing and Processing"
UR  - https://ieeexplore.ieee.org/servlet/opac?bknumber=8726249
ER  -