TY  - BOOK
AU  - Henshall
TI  - Lead-Free Solder Process Development
SN  - 9780470901199
PB  - IEEE
KW  - "Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; General Topics for Engineers; Geoscience; Power, Energy and Industry Applications"
UR  - https://ieeexplore.ieee.org/servlet/opac?bknumber=5732782
ER  -