| 000 | 00574nam a2200145Ia 4500 | ||
|---|---|---|---|
| 008 | 210311s9999 xx 000 0 und d | ||
| 020 | _a978-3-662-48823-2 | ||
| 100 | _aQingke Zhang | ||
| 245 | 0 | _aInvestigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces | |
| 260 | _bSpringer | ||
| 260 | _c2016 | ||
| 650 | _a"Engineering; Surfaces and Interfaces, Thin Films; Classical Mechanics; Characterization and Evaluation of Materials" | ||
| 856 | _uhttp://link.springer.com/openurl?genre=book&isbn=978-3-662-48823-2 | ||
| 942 | _cEBOOK | ||
| 999 |
_c35855 _d35855 |
||