| 000 | 00489nam a2200145Ia 4500 | ||
|---|---|---|---|
| 008 | 210311s9999 xx 000 0 und d | ||
| 020 | _a978-981-10-8884-1 | ||
| 100 | _aJohn H. Lau | ||
| 245 | 0 | _aFan-Out Wafer-Level Packaging | |
| 260 | _bSpringer | ||
| 260 | _c2018 | ||
| 650 | _aEngineering; Circuits and Systems; Nanotechnology and Microengineering; Optical and Electronic Materials | ||
| 856 | _uhttp://link.springer.com/openurl?genre=book&isbn=978-981-10-8884-1 | ||
| 942 | _cEBOOK | ||
| 999 |
_c38404 _d38404 |
||