| 000 | 00448nam a2200133Ia 4500 | ||
|---|---|---|---|
| 008 | 210311s9999 xx 000 0 und d | ||
| 020 | _a9781119313991 | ||
| 100 | _aKeser | ||
| 245 | 0 | _aAdvances in Embedded and Fan-Out Wafer Level Packaging Technologies | |
| 260 | _bIEEE | ||
| 650 | _a"Components, Circuits, Devices and Systems; Computing and Processing" | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?bknumber=8726249 | ||
| 942 | _cEBOOK | ||
| 999 |
_c40229 _d40229 |
||