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|---|---|---|---|
| 008 | 210311s9999 xx 000 0 und d | ||
| 020 | _a9781118166727 | ||
| 100 | _aLi | ||
| 245 | 0 | _a"Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC" | |
| 260 | _bIEEE | ||
| 650 | _a"Components, Circuits, Devices and Systems" | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?bknumber=6183551 | ||
| 942 | _cEBOOK | ||
| 999 |
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||