TY  - BOOK
AU  - Hsu, Tai-Ran
TI  - MEMS and Microsystems Design and Manufacutre
SN  - 9780070487093
U1  - 621.381 HSU 23rd Ed.
PY  - 2018///
CY  - Chennai
PB  - McGraw Hill Education(India) Private Ltd.
KW  - Microelectromechanical systems; Microelectronics; Microelectronic packaging
N1  - It includes index.

Microsystems and MEMS technology represents one of the biggest breakthroughs in the area of mechanical and electronic technology to occur in recent years. This is the technology of extremely small and powerful devices – and systems built around such devices – which have mechanical and electrical components. MEMS technology is beginning to explode, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarize future engineers with this broad-ranging technology. Hsu's MEMS & MICROSYSTEMS text provides an engineering design approach to MEMS and microsystems, appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases, and applied problems. The book is appropriate for Mechanical and Aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical Engineering students will be provided strong coverage of the mechanical side of MEMS, something they may not receive from other courses in their curriculum.

Contents:

1 Overview of MEMS and Microsystems2 Working Principles of Microsystems3 Engineering Science for Microsystem Design and Fabrication4 Engineering Mechanics for Microsystems Design5 Thermofluid Engineering and Microsystem Design6 Scaling Laws in Miniaturization7 Materials for MEMS and Microsystems8 Microsystem Fabrication Processes9 Overview of Micromanufacturing10 Microsystems Design11 Microsystem PackagingAppendixes1 Recommended Units for Thermophysical Quantities2 Conversion of Units between SI and Imperial Systems
ER  -